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Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights

Written by | Published: 08.14.2025

What is the current state of TEM in semiconductor analysis?

Transmission electron microscopy (TEM) has become a crucial tool in semiconductor manufacturing. Modern semiconductor fabrication requires atomic-scale imaging and analysis capabilities, particularly for complex three-dimensional (3D) structures, such as gate-all-around (GAA) logic transistors and 3D NAND memory channels.

How does TEM technology work?

TEM operates by directing an electron beam through an ultra-thin sample. The transmitted electrons interact with various filters, detectors, and cameras below the sample. Key operational aspects include:

  • Acceleration voltages—60 kV to 300 kV range for semiconductor applications
  • Resolution capability—down to individual atom visualization
  • Analysis modes—TEM and STEM (scanning TEM)
Diagram comparing optical microscope with light source and lenses to TEM with electron source and lenses

Fig 1: Comparison diagram of optical microscope and TEM configurations.

What are the key differences between TEM and STEM modes?

TEM mode:

  • Uses a focused beam on the sample
  • Captures transmitted electrons in a single snapshot
  • Employs high-speed, high-resolution cameras
  • Offers faster, simpler operation
Schematic of TEM mode operation displaying electron source, lenses, specimen holder, and viewing screen in sequence.

Fig 2: Schematic illustration of TEM mode operation.

STEM mode:

  • Utilizes electromagnetic scan coils
  • Scans a focused beam across the sample
  • Multiple detector configurations available
  • Provides flexible, high-contrast imaging
Schematic of STEM mode operation displaying electron source, lenses, scanning coils, specimen holder, detector, and viewing screen in sequence

Fig 3: Schematic illustration of STEM mode operation.

How has automation enhanced TEM analysis?

Modern semiconductor TEM systems feature significant automation improvements:

  • Simplified parameter selection
  • Automated alignment and calibration
  • Reduced data distortion risk
  • Atomic-scale image calibration
  • Streamlined operation for various sample types


Why is TEM critical for semiconductor manufacturing?

TEM serves as the primary source for reference data in semiconductor design and fabrication due to:

  • Increased 3D device complexity
  • Shrinking critical dimensions
  • EUV lithography requirements
  • Need for atomic interface analysis
  • Strain and magnetic field measurements


What are the key applications and the industry impact?

Leading semiconductor manufacturers now generate tens of thousands of TEM datasets monthly for:

  • Process variation analysis
  • Wafer fab tool calibration
  • Defect mechanism investigation
  • Quality control
Line graph depicting the increasing trend in semiconductor TEM analysis usage

Fig 4: Graph showing growth trend in semiconductor TEM analysis usage.


Summary

  • TEM technology provides atomic-level imaging and analysis capabilities
  • Dual-mode operation (TEM/STEM) offers flexible analysis options
  • Automation advances have simplified operation and improved reliability
  • Critical role in semiconductor manufacturing quality control
  • Essential for next-generation device development

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Paul Kirby is a Senior Marketing Manager at Thermo Fisher Scientific

Paul Kirby

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